The Greening of CMP: Improvements in Chemical and Material Efficiencies and Life Cycle Management

"The reliance on chemical mechanical planarization (CMP) for integrated circuit (IC) manufacture has increased. CMP has a large environmental footprint, primarily due to the amount of materials consumed for a typical process of record (POR) and the associated waste generated. Improving the process efficiency will reduce the envi- ronmental footprint and decrease the cost of ownership."
S. Benner and D. Peters

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Reducing CMP Variation

Stephen J. Benner
NCCAVS 2016, April 7, 2016

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Pad Surface Manager™

Christopher C Choffat

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Reduction of CMP-induced wafer defects through in-situ removal of process debris

S. J. Benner; G. Perez; D. W. Peters; K. Hue; P. O'Hagan


How to control CMP pad debris causing defects?

"Recent studies show that pad debris generated during conditioning may result in significant CMP defects. How dominant is this effect, and what new approaches might we take to conditioning or pad materials?"
Comments posted by Darryl Peters


Pad Conditioner Improves CMP Efficiency

"Optimization of CMP processes is typically carried out using monitor wafers with off-line analysis of wafer surfaces for defects and quality. Confluense has tackled the limitations of that approach with a pad conditioning system designed to improve the utilization efficiency of CMP consumables by reducing the average residence time of spent materials."
Daily News; Semicon West 2009; Wednesday July 15th, 2009; published by Semiconductor International

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CMP Optimization and Control Through Real-time Analysis of Process Effluents

S.J. Benner and D.W Peters
NCAVS 2009, July 15, 2009

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