About UsSince our formation in 2008, we have pursued the development of methods and systems designed to vastly improve the intensity, efficiency, and process capability of the semiconductor wafer fabrication process known as chemical mechanical polishing. Dramatically reducing consumption, variability, and cost.
The company was spun out of a diamond abrasive manufacturer, TBW Industries, who was an early entrant in the pad conditioning abrasive market. Confluense's technology and enhancement product (PSM) operates with any pad conditioning abrasive, any slurry, any pad, and can be adapted/integrated to any polishing tool.
Confluense is committed to efficiency: supply efficiency, process efficiency, maintenance efficiency, and maximizing the benefit received by the end user.